HiDEC houses facilities for low temperature co-fired ceramic (LTCC) processing, electronic assembly, reliability testing and machining.
If you have a question about any laboratory or process available at HiDEC, please contact the manager responsible for that specific laboratory. Likewise, if you notice any equipment issues or have safety concerns, please notify the responsible laboratory manager immediately.
HiDEC’s Analytical Laboratory provides tools for manufacturing and inspection.
This lab houses the most common equipment necessary to complete the final stages of the electronic packaging processes including wire bonding, soldering, and flip-chip attachment.
HiDEC’s Low Temperature Co-fired Ceramics (LTCC) facility offers multi-layer substrate manufacturing for high-power modules, microwave circuits, and other applications.
The HiDEC reliability laboratory houses a number of reliability tools, all of which are available for use by both University researchers and external clients.