The HiDEC Assembly Laboratory is located in ENRC-4514 and includes approximately 825 sq. ft. of space. Approximately 200 sq. ft. of the lab is a class 10,000 cleanroom area that houses the wire bonding and flip-chip attachment tools.
This lab houses all the equipment necessary to complete the final stages of most electronic packaging processes, including wafer dicing, wire bonding, soldering, and flip-chip attachment.
If you have a question about any laboratory or process available at HiDEC, please contact the manager responsible for that specific laboratory. Likewise, if you notice any equipment issues or have safety concerns, please notify the responsible laboratory manager immediately.