Services
Wire Bonding
Product support from ground-breaking research to demonstration and commercialization
Backend Packaging Opportunities for Academic and Industrial Users
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Wire bonding is the process of electrically connecting an active element to a substrate. Our service include attachment via fine wire aluminum bonding (1 to 3 mils), heavy wire aluminum bonding (5 to 20mils), fine wire gold bonding and gold ball bumping. *It should be noted that some configurations may require additional time and money to make available.
FINE ALUMINUM/GOLD WIRE BOND SPECIFICATIONS
- Wire diameters: 18µm to 75µm*
- Ribbon: 25µm x 250µm*
- Bond material: Aluminum and gold
- Heated work holder: Yes
- Bond area: 134mm x 134mm
- Bond force: Up to 156 cN
- Transducer frequency: 60kHz
FINE GOLD (BALL) WIRE BOND SPECIFICATIONS
- Wire diameters: 18µm to 75µm*
- Ribbon: 25µm x 250µm*
- Bond material: Aluminum and gold
- Heated work holder: Yes
- Bond area: 134mm x 134mm
- Bond force: Up to 156 cN
- Transducer frequency: 60kHz
HEAVY ALUMINUM WIRE BOND SPECIFICATIONS
- Wire diameters: 100µm to 500µm*
- Ribbon: 75µm x 75µm to 300µm x 2mm*
- Bond material: Aluminum and copper*
- Heated work holder: No
- Bond area: 254mm x 244mm
- Bond force: Up to 1400 cN
- Transducer frequency: 60kHz