Possibilities

Did you know that HiDEC plans to add an x-ray imager to its Power Module capability? This system provides a quantitative analysis of voids under die and substrates that have undergone the high temperature die/substrate attach. The analysis is crucial as it is a ‘go/no-go’ should the voiding to be found outside the acceptable limit (i.e. 1% for die and 10% for substrate).

Quadra V x-ray imager ($253K): Acquire to enhance void analysis of power module assembly.

Did you know that HiDEC plans to add a dedicated automated gate/Kelvin wire bonder to its Power Module capability? This system would be configure for smaller gauge wire (5mil) to be more compatible with gate pad die on most die fabricated today.

Hesse BJ935/939 heavy wire bonder ($175K): Acquire to provide dedicated, automated  gate/Kelvin wire bonding for power module assembly.

Did you know that HiDEC plans to add a Pick and Place tool to its Assembly capability? This system provides low to medium volume SMT placement for any type of package component requirement that is not easily implemented with our existing Finetech die bonder.

DDM Novastar LE40V Automated Pick & Place with Cognex Vision ($35K): Acquire to provide accurate placing on conventional package active and passive components for both the LTCC and Power Module facilities.