Assembly Equipment
The Assembly Lab (ENRC 4802) houses solder reflow, die attach and wire bond tooling for all electronic assembly needs. Depending on the tooling in question, either Tom Cannon or Errol Porter would be the contact for details, training and access to the tools in this facility.
Diener electronic PICO 5
Single etch chamber. Tool is configured with oxygen (O2) to selectively remove organics then argon (Ar) is used to remove any oxide created during the oxidation run. Generally, a three-minute oxygen clean then a five-minute argon clean is used prior to a solder reflow or wire bond process.
Cost: $10/hour (academic)
| Specifications | Units |
|---|---|
| Power | 150W |
| Pressure | 0.8/0.3 mbar (O2/Ar) |
| Oxygen flow | 6.9 sccm |
| Argon flow | 12.5 sccm |
| Temperature | Ambient |
Exact Dispensing VC-18 Vacuum Chamber System
Vacuum chamber designed to create a vacuum environment while dispensing encapsulant to insure a void free coverage.
Cost: $60/hour (academic)
| Specifications | Units |
|---|---|
| Vacuum | 2 Torr |
| Temperature | Ambient |
Finetech Sigma 2406 Die Bonder
The Finetech Sigma 2406 die bonder micro assembly system is capable of attaching components with placement accuracy up to +/- 0.5 micron, ideal component sizes ranging from 0.30 mm x 0.30 mm to 10 mm x 10 mm. System supports a multitude of bonding technologies including thermo-compression, thermosonic, ultrasonic, vacuum soldering and sintering.
Cost: $60/hour (academic)
| Specifications | Units |
|---|---|
| Work size | 100mm2 |
| Chip temperature | 450 °C |
| Substrate temperature | 450 °C |
| Heated bond force | 0.2 to 40N |
| Unheated bond force | Up to 500N |
| Ultrasonic specifications | 40W @ 60KHz |
| X,Y,Z axis accuracy | 0.1 µm |
| X, Y, Z axis accuracy: | 0.1um |
| Theta rotation | ± 15 degrees |
Fisher Isotemp 281A Vacuum Oven
The Fisher Isotemp vacuum oven is used to cure epoxies, encapsulants, solders, and other materials that do not give off chemical residues. Simple design with a knob to initiate a vacuum then another knob to purge the chamber with nitrogen to bring the chamber back to atmosphere.
Cost: $3/hour (academic)
| Specifications | Units |
|---|---|
| Temperature | Up to 280 °C |
| Vacuum | 30mmHg |
| Purging gas | Nitrogen |
Equipment Tutorial:
Fisher Isotemp 281A Vacuum Oven
Heidenhain VRZ 760B digital micrometer
This digital micrometer controller is tied to a Micromeasure optical stage with microscope to allow the measurement of features on samples in X, Y and Z. An external camera and monitor have been added for ease of reference identification. The system provides measurements in either inches or millimeters.
Cost: $3/hour (academic)
| Specifications | Units |
|---|---|
| Measurement resolution | Four decimal places |
Hesse BJ935 Heavy Aluminum Wire Bonder
The Bond Jet BJ935 is an ultrasonic wedge-wedge wire bonder developed for fully automated or manual processing of a wide range of substrates, chips, and other materials. Though currently configured for 12mil aluminum wire, the tool has accessories to allow for ribbon and even copper bonding.
Cost: $60/hour (academic)
| Specifications | Units |
|---|---|
| Wire capacity | 125 to 600 micron |
| Work area | 254 x 244 mm |
| Bond force | Up to 2500 cN |
| Ultrasonic power | 100 W |
| Cutter | Back cut |
| X,Y,Z Repeatability | +/- 10 microns |
Kulicke & Soffa Industries 4523 Wedge Bonder
The Kulicke & Soffa Industries Model 4523 wire bonder is a manual unit capable of wedge bonding. Supported wire materials include aluminum ranging in diameter from 0.7 mils to 3 mils. One mil wire (both aluminum and gold) is kept in-stock for laboratory users; other sizes can be accommodated if the user wishes to purchase the required wire and wedges/capillaries. Ribbon bonding is also possible with this tool; 3 mil x 10 mil aluminum ribbon is available.
Cost: $20/hour (academic)
| Specifications | Units |
|---|---|
| Wire capacity | 17 to 75 µm |
| Work area | 75 mm |
| Temperature | Up to 200°C |
Kulicke & Soffa Industries 4700 Ball/Wedge Bonder
The K&S 4700 Ball/Wedge bonder is a manual unit capable of either ball or wedge bonding. Supported materials include either aluminum or gold ranging in diameter from 0.7 mils to 3 mils. This bonder provides the option to bond gold bumps or studs. One mil wire (both aluminum and gold) is kept in-stock for laboratory users; other sizes can be accommodated if the user wishes to purchase the required wire and wedges/capillaries. Ribbon bonding is also possible with this tool; 3 mil x 10 mil aluminum ribbon is available.
Cost: $20/hour (academic)
| Specifications | Units |
|---|---|
| Wire capacity | 17 to 75 µm |
| Work area | 75 mm |
| Temperature | Up to 200°C |
| Bond options | Ultrasonic or Thermosonic |
| Special mode | (Au) Ball bumping |
Equipment Tutorial:
Kulicke & Soffa Industries 4700 Ball-Wedge Bonder
Orthodyne Model 20 Heavy Wire Bonder
The Orthodyne Model 20 is a manual bonder designed for 4 to 20mil aluminum wire. The two units in the lab are currently set up for 5mil and 12mil wire. An external camera and monitor have been added to help with bond placement. The height of the custom vacuum chuck is adjustable.
Cost: $20/hour (academic)
| Specifications | Units |
|---|---|
| Wire capacity | 102 to 508 micron |
| Work area | 75 mm diameter |
| Gram force | Up to 1000 grams |
| Power | Up to 550 |
Equipment Tutorial:
Orthodyne Model 20 Heavy Wire Bonder
Sikama 5/C Reflow Oven
The Sikama 5/C has four (4) heat zones controlled both above and below the sample to allow for individual adjustment for most solder reflow applications. Nitrogen gas flow is also adjustable at each zone to ensure the sample is blanketed during the reflow process to avoid unwanted oxidation.
Cost: $10/hour plus N2 @$20/inch (academic)
| Specifications | Units |
|---|---|
| Maximum size | 125.4 mm x 144 mm |
| Conveyor speed | 7.5 to 125 cm/min. |
| Temp. Zones | 4 |
| Operating Temp. | Up to 420°C |
| N2 Gas flow | Up to 100 SCFH/zone |
Equipment Tutorial:
Sikama 5.C Reflow Oven
SST 3130HT Brazing furnace
The programmable vacuum furnace is routinely used to obtain void-free solder joints without the use of flux. HiDEC purchased the HT option that can heat up to 1000°C in an inert gas (4% hydrogen in nitrogen) from vacuum levels of below 50mTorr to pressures exceeding 40 psig. Parts are heated on a graphite plate with up to four temperature probes that can be placed at different sites.
Cost: $60/hour (academic)
| Specifications | Units |
|---|---|
| Operating temperature | 25 to 1000°C |
| Work area | 100 x 125mm |
| Vacuum level | 50mTorr |
| Pressure range | Up to 50 psig |
| Work height | 96 cm |
SST 5100 Solder vacuum oven
The programmable vacuum furnace is routinely used to obtain void-free solder joints without the use of flux. This unit has a formic acid preclean cycle run at 210°C and a reflow heat limit of 450°C in an inert gas (4% hydrogen in nitrogen) from vacuum levels at 50mTorr to pressures exceeding 40 psig. Parts are heated on a graphite plate with up to four temperature probes that can be placed at different sites.
Cost: $60/hour (academic)
| Specifications | Units |
|---|---|
| Temperature range | 100 to 450°C |
| Work area | 930cm2 |
| Vacuum level | ~50mTorr |
| Pressure range | ~40 psig |
| Work height | 11 cm |
Valhalla 5880A HiPot tester
This analyzer combines four basic dielectric tests into one unit. The multi-function capabilities include;
- AC Dielectric strength testing
- DC Dielectric strength testing
- Insulation Resistance (IR) measurement
- Earth Continuity measurement
Cost: $15/hour (academic)
| Specifications | Units |
|---|---|
| Max voltage range | Up to 5000 V |
| Max current range | Up to 10 mA |
| IR range | Up to 100 GΩ |
| Earth continuity range | Down to 10 mΩ |