HiDEC Training Camps

This Training Camp has been developed to familiarize the participants with the Broad Stages of PCB Design process which are Schematic/Layout Design, PCB Manufacturing, and PCB Assembly using OrCAD Capture CIS and Allegro PCB Editor software’s. The overall goal of the Training Camp is to provide hands-on practice with the first Stage of a PCB Design, which is “the actual design” done with the aid of an EDA(Electronic Design Automation)/Software. Tasks include the creation of schematics, creation of layout, creating custom PCB components and their footprints, generating the various types of PCB design files required for manufacturing.

This Training Camp aims to equip electronics engineers and researchers with practical knowledge and skills in soldering and SMT processing. Participants will gain a comprehensive understanding of the principles, techniques, and best practices involved with soldering methods, which are crucial for successful electronic device manufacturing. The course will combine theoretical concepts with hands-on laboratory exercises to provide a well-rounded learning experience.

The purpose of the wire bonding training camp is to expose researchers in the electronics processing and assembly field to wire bonding fundamentals, its core principles, and design considerations for best practices, as well as to provide a practical, hands-on experience. This training is designed to ensure that participants gain a deep understanding of wire bonding techniques as well as its importance to manufacturing high-quality electronic devices.