Research Associate,Research Associate
Kaoru U. Porter received the B.S. and M.S. degrees in electrical engineering from the University of Arkansas at Fayetteville, in 1995 and 1997, respectively. Currently holding the title of Research Associate, Ms. Porter manages the operation of the High Density Electronics Center (HiDEC) Ceramic Integration Laboratory housed within the University of Arkansas’ Department of Electrical Engineering. Ms. Porter has been in her current position since 2007 providing equipment and process training associated with low temperature co-fired ceramic (LTCC).
Kaoru Maner, Errol Porter, Len Schaper, Simon S. Ang, and William D. Brown, “The Seamless High Off-Chip Connectivity (SHOCC) packaging technology”, Proc. of the Electrochemical Society, (1999) pp. 188-191.
Kaoru Maner, Simon S. Ang, Len Schaper, and William D. Brown, “Polymeric conductive pastes as solder replacement for flip-chip attachment.”, IEEE Transactions on Components, Packaging, and Manufacturing Tech., Part A and B, (1998) pp. 247-251.
Len Schaper, Kaoru Maner, and Simon S. Ang, “Reliability of large conductive polymer flip chip assemblies for multichip modules (MCMs)”, Proc. of the Int. Conf. on Multichip Modules, (1997) pp. 87-91.
Kaoru Maner, Simon S. Ang, and Len Schaper, “Reliability of large conductive polymer flip chip assemblies for multichip modules (MCMs)”, Proc. of the Int. Elect. Packaging Conf. (IEPC) (1996) pp. 3-13.
2006 – 2007 Research Support – Arisetek, LLC., Fayetteville, AR
2006 – 2006 Senior Process Development Engineer – OmniPak LLC., Fayetteville, AR
2003 – 2005 Unit Pay Employee — High Density Electronics Center, U of A, Fayetteville, AR
2004 – 2004 Senior Process Development Engineer – Moducell, Inc., Fayetteville, AR
2002 – 2003 Process Development Engineer – Integral Wave Technology, Fayetteville, AR
1997 – 2002 Research Assistant — University of Arkansas, Fayetteville, AR