Thin Film Cleanroom

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Specialty Vacuum Technologies PVD-1 E-beam Evaporator

The Specialty Vacuum PVD-1 is a multipocket e-beam evaporator capable of evaporating moderate quantities (up to 4 microns) of almost any material. The material either in solid form or in a crucible is heated by electron bombardment from the bottom mounted filament allowing temperatures in excess of 2,700 degress Celsius.

 

Cost: Standard rate

 

 

 

 

 

 

Specifications:   
Source pocket capacity: 4
Bakeout temperature: 200 °C
Crucible volume: 7cc
Operating pressure: < e-6 torr
Partial pressure: 1e-5 torr
Power supply: 3kW
Sample head position range: 0 to 90 degree
Sample rotation: Continuous & variable
Gas options: Oxygen
Thickness monitor rate: nm/sec
Thickness monitor culmulative units: KAngstroms
Amerimade (acid) Wet Bench

Standard isotropic immersion process to dissolve selective areas of metal not masked by photoresist. Bench is configured with four dump rinse tanks, glove rinse, two DI water guns, one nitrogen gun, four slots for integrated heated tanks, and perforated wet deck for hot plate use capable of handling up to 125mm diameter wafers.

 

Cost: Standard rate

Specifications:   
Accessories: Four dump rinse tanks, glove rinse, two DI water guns, one nitrogen gun, four slots for integrated heated tanks, and perforated wet deck for hot plate use.
Material: Aluminum (Transene Aluminum etch Type D), chromium (HTA enterprises; CEP-200), gold (Transene Gold Etchant GE-8148), silicon dioxide (Buffered oxide etch 7-to-1 & 5-to-1), titanium (2.5% Hydrofluoric, 0.5% Nitric)
Wafer handling: 125 mm
Etch rate: 100 nm/min
Temperature: Ambient to 50°C
Chemcut SA2315 Spray Etcher

Compact, double-sided, horizontal conveyorized spray-etch system. Tool is configured with Ferric chloride (FeCl3) to dissolve selected areas of thick metal (aluminum or copper) foil on printed circuit boards or alumina plates not masked by patterned dry film photoresist.

Cost: Standard rate

 

Specifications:   
Material: Aluminum, copper (Ferric chloride)
Etch rate: 25 microns/min
Substrate handling: 100 mm x 150 mm to 200 mm x 200 mm
Temperature: Ambient to 52°C
EBL Fumehood

Fume hood is used to process PMMA resist.

Cost: Standard rate

 

 

 

 

Specifications:   
Accessories: N2 gun, DI gun, drain
LFE Asher APE110

Single etch chamber. Tool is configured with oxygen (O2) to remove patterned photoresist on silicon wafers.

Cost: Standard rate

 

 

 

 

 

 

 

 

 

Specifications:   
Typical operating parameters: 0.4 Torr, 500 W, 80-200 sccm total gas flow
Material: Photoresist
Wafer handling: 125 mm
Etch rate: 100 nm/min
Temperature: Ambient
Suss Microtec MA4 Contact Aligner

This unit has a wafer-to-mask alignment system, 1000W UV tower.

 

Cost: Standard rate

 

 

 

Specifications:   
Typical intensity: Up to 10 mW/cm^2 @365 nm wavelength
Resolution: Approximately 2.5 microns
Substrate handling: 25 mm & 125 mm
Suss Microtec MJB3 Contact Aligner

This unit has a wafer-to-mask alignment system and 200W UV tower.

Cost: Standard rate

 

 

 

 

Specifications: 
Typical intensity: Up to 10 mW/cm^22 @365 nm wavelength
Resolution: Approx. 2.0 microns
Substrate handling: 25 mm & 100 mm
RTC LA-306 IR Belt Furnace

Belt furnace for curing polymer, sintering inks or firing tape. The system operates up to 900oC with three separately controlled heat zones. System is configured to use with compressed air to fire ink on solar cells or nitrogen for low O2 applications. The belt has been reconfigured to run up to 33cm/min.

 

Cost: Standard rate

 

Specifications:   
Zones: Three
Speed: 1 to 240 cm/min
Temperature: 900°C
Gases: Air, nitrogen
Kepro Dry Film Laminator

This tool is used to apply dry film photoresist (Riston&trade;) to the surface of printed circuit boards (PCBs) and direct bonded copper/aluminum substrates. Photoresist is fed from a continuous roll, so the length of the board or substrate to be laminated is limited by available desk space.

Cost: Standard rate + $4.00 per linear ft. of film.

 

Specifications
Max. substrate width 12 inches
Dry film thickness Approximately 2 mils (50 microns)

 

Microcircuit Engineering Corp. Exposure System

This tool is used to expose apply dry film photoresist or photo-emulsions on PCBs, substrates, or silkscreens; a typical exposure time for dry film photoresist is 2 minutes. After power-on, the unit must stabilize for 10 minutes before use to assure consistent exposures. This unit is for single-sided exposure only.

Cost: Standard rate

 

Specifications
Max. substrate/board size 15″ x 15″ inches (approx.)
Thermolyne Type 2200 Hot Plate

The Thermolyne hot plate is commonly used in the darkroom for pre-heating of printed circuit boards or direct bonded copper/aluminum substrates before the lamination of dry film resist. It has a maximum temperature of 300C.

Cost: Standard rate

 

 

Specifications
Heated surface size 15 inches X 15 inches (approx.)
Maximum temperature 300C