Equipment

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This section presents the full catalog of processing equipment at HiDEC that is available for use by academic and industrial users.

Tools are available for low temperature co-fired ceramics (LTCC) fabrication, and electronic assembly. Auxiliary laboratories provide space for wet processing, dry-film patterning, reliability testing and small-scale machining (general, CNC and 3D).

Although equipment common to a given process is typically housed in the same area, most clients will use two or more laboratory spaces to complete their work. Users are required to receive equipment training and certification from the laboratory manager responsible for a given laboratory.

ANALYTICAL EQUIPMENT

The Analytical Lab (ENRC 4308 ) houses metrology, machining and cross-sectioning tooling for post evaluation of substrates and modules developed in either the LTCC or power assembly laboratory. Tom Cannon would be the main contact for details, training and access to the tools in this facility.

Pico

ASSEMBLY EQUIPMENT

The Assembly Lab (ENRC 4802) houses solder reflow, die attach and wire bond tooling for all electronic assembly needs. Depending on the tooling in question, either Tom Cannon or Errol Porter would be the contact for details, training and access to the tools in this facility.

Thermo-Scientific-55-3L-Box-Furnace

LTCC EQUIPMENT

LTCC (HDEC ) houses punch, print, in-situ metrology, collate, laminate and firing tooling. The facility also holds wet etch, dry etch and dicing capabilities. Depending on the tooling in question, either Errol Porter or Kaoru Porter would be the contact for details, training and access to the tools in this facility.

delta1

RELIABILITY EQUIPMENT

The Reliability Lab (ENRC 4312 ) houses environmental test equipment and thermal shock tooling for all electronic assembly needs. Tom Cannon would be the contact for details, training and access to the tools in this facility.