Assembly Equipment

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Finetech Sigma 2406

The Finetech Sigma 2406 die bonder micro assembly system is capable of attaching components with placement accuracy up to +/- 0.5 micron, ideal component sizes ranging from 0.30 mm x 0.30 mm to 10 mm x 10 mm. System supports a multitude of bonding technologies including thermo-compression, thermosonic, ultrasonic, vacuum soldering and sintering.

Cost: Standard rate

 

Specifications

Chip heating temperature: 450 °C
Substrate heating temperature: 450 °C
Substrate heating Working area max: 100mm x 100mm
Vacuum chamber heating working area max: 45mm x 45mm
Integrated (heating) bonding force module: 0.2N up to 40N
Non-heated bond force module: 500N
Ultrasonic module: 40W, 60KHz
X, Y, Z axis accuracy: 0.1um
Theta rotation range: +/-15 degrees
Workholder working envelope: X (350mm), Y (150mm), Z (70mm)
Kulicke & Soffa Industries Model 982-10 Dicing Saw

The K & S 982-10 dicing saw is capable of dicing wafers and other materials (ceramic, glass) up to 8 inches in diameter. Dicing blades with various widths and grit sizes are available; consult with the lab manager to help you choose the proper blade for your application.

Cost: Standard rate

Specifications

Theta rotation 90 degrees
Resolution 0.8 microns
Maximum substrate size 8 inches diameter (200 mm)
Fisher Isotemp Vacuum Oven Model 281A

The Fisher Isotemp vacuum oven is used to cure epoxies, encapsulants, solders, and other materials that do not give off chemical residues. Specifications

Cost: Standard

Specifications

Max Temperature 280C
Max Vacuum Pressure 30mmHg
Purging Gas Nitrogen
Kulicke & Soffa Industries Model 4700 Combination Wedge/Ball Wire Bonder

The Kulicke & Soffa Industries Model 4700 wire bonder is a manual unit capable of both wedge and ball bonding. Supported wire materials include aluminum and gold ranging in diameter from 0.7 mils to 3 mils. The unit is completely self-contained and includes a programmable negative electronic flame-off system that is capable of fine control of ball size. The work holder can be heated to approximately 200C. One mil wire (both aluminum and gold) is kept in-stock for laboratory users; other sizes can be accommodated if the user wishes to purchase the required wire and wedges/capillaries. Ribbon bonding is also possible with this tool; 3 mil x 10 mil aluminum ribbon is available.

Cost: Standard rate

Specifications

Other bond modes available ball/”stud” mode, stitching
Work holder maximum temperature 200C
Maximum wire size 3 mils
Minimum wire size 0.7 mils

 

Kulicke and Soffa Industries Model 960-8 Tape Mounter

The Kulicke and Soffa Industries Model 960-8 tape mounter is used to mount wafers and various other substrates (ceramic, glass) to dicing tape to facilitate dicing with the dicing saw. Training for this tool is performed at the same time as dicing training. Users should plan 40-60 mins into their schedule to allow the unit to heat up before use. The auto-cut feature of the unit is currently not functioning, so users must cut the tape manually using a utility blade.

Cost: Standard rate

 

Specifications

Tapes available Low-tack and high-tack tapes available for additional cost
Maximum subtrate size 8 inches (200 mm)
Orthodyne Model 20 Wire Bonder

The Orthodyne Model 20 wire bonder is a manual wire bonder capable of bonding 5mil-20mil aluminum wire. The two units in the lab a currently set up for 5mil and 12mil wire.

Cost: Standard rate

 

Specifications

Maximum wire size 20 mils
Minimum wire size 5 mil
Sikama 5/C Reflow Oven

The Sikama 5/C is used to perform solder reflow. Nitrogen flows around all samples during reflow to avoid unwanted oxidation. The unit has four (4) zones in which the temperature above and below the sample can be programmed individually.

Cost: Standard rate

 

 

Specifications

Speed Mode (Inches Per Minute) 3 to 50 in/min. (7.5 to 125 cm/min.)
Time Mode (Dwell) 1 sec. to 99 min. 59 sec. (per zone)
Maximum Substrate Size 5″ x 5.75″ (1254 mm x 144 mm)
Temperature (Standard) Up to 420C
Kulicke & Soffa Industries 4523 Wedge Bonder

The Kulicke & Soffa Industries Model 4523 wire bonder is a manual unit capable of wedge bonding. Supported wire materials include aluminum ranging in diameter from 0.7 mils to 3 mils. The work holder can be heated to approximately 200C. One mil wire (both aluminum and gold) is kept in-stock for laboratory users; other sizes can be accommodated if the user wishes to purchase the required wire and wedges/capillaries. Ribbon bonding is also possible with this tool; 3 mil x 10 mil aluminum ribbon is available.