Capabilities

 HiDEC capabilities cover nearly every process needed for electronic integration fabrication and research. Center capabilities include:

  • Thin film processing
  • Low-Temperature Co-fired Ceramics (LTCC) fabrication
  • Electronic assembly
  • Design services
  • Reliability testing and analysis
  • Electrical characterization and RF/microwave measurement
  • Cross section analysis

Areas of Expertise

System integration is at the core of all HiDEC activity. Various focus areas contribute to HiDEC core efforts, including low temperature co-fired ceramic (LTCC), advanced electronic packaging, electronics on flexible substrates, power electronics packaging and power device integration, sensor integration, and the integration of energy conversion technology.

Throughout the 24+ year history of HiDEC, expertise has been developed in a number of areas, including:

  • Device and module packaging for wide bandgap power devices
  • Flexible substrate fabrication
  • Embedded passives on flexible and ridged substrates
  • Sensor integration
  • Integration of energy conversion technology