The University of Arkansas' High Density Electronics Center (HiDEC) is one of only a few working laboratories of its kind in the United States located on a university campus. Since its inception, HiDEC personnel have pursued a program of excellence in research and education, which has earned the program an international reputation.
Established in 1991, the HiDEC facilities include nearly 6,000 square feet of clean room space which houses conventional MCM processing on five-inch wafers, deposition and photolithographic definition of thin film materials, and package assembly. In addition, there are separate labs dedicated to electronic assembly, reliability testing, electrical measurements, and low-temperature, co-fired ceramics (LTCC).
Recently, HiDEC research has expanded to include other aspects of advanced electronic packaging, including (but not limited to) such areas as materials synthesis, low-cost MCM design techniques, flip chip die attachment, flexible substrates, integrated passive components, low temperature cofired ceramic, wideband electrical characterization, and analytical lifetime testing.
UA graduate students have a unique opportunity to pursue a degree with an emphasis in electronic packaging and multichip technology. Extensive hands-on laboratory experience has led graduates to exceptional jobs in industry with leading companies. A number of regular courses are taught at HiDEC, including "Microelectronic Fabrication Techniques and Procedures", "Integrated Circuits Fabrication Laboratory", and "Solar Cell Fabrication".
HiDEC provides a unique opportunity for small technology companies in Arkansas (and elsewhere) by providing 24/7 access to its labs at reasonable hourly rates. Companies within the Arkansas Research and Technology Park have convenient access to our facilities and can leverage HiDEC capabilities and expertise to their benefit.